Development of a broadband Wilkinson Power Combiner on Liquid Crystal Polymer
Chieh, Jia-Chi Samuel and Pham, Anh-Vu (2009)
Description:This paper present the development of a broadband multisection Wilkinson power combiner on Liquid Crystal Polymer (LCP) with integrated thin film resistors. The designed frequency of operation is from 2-18 GHz. The measured VSWR is better than 1.6:1, the measured excess insertion loss is less than 1.1dB, and 11dB of isolation is measured across the full band. This work presents the highest performance Wilkinson combiner with the widest bandwidth ratio of 9:1 reported in literature.
Monolithic Low Cost Ka-Band Wilkinson Power Dividers on Flexible Organic Substrates
Horst S., Bhattacharaya S., Tentzeris M., and Papapolymerou J.
Description:A millimeter wave Wilkson power divider is presented on a thin and durable organic substrate, along with an analysis of bend topologies to reduce coupling between the output paths. The divider provides excellent performance across the entire Ka-band from 27 to 40 GHz. Insertion loss is approximately 0.3 dB and isolation between the output ports is around 30 dB at the design frequency.
Embedded Passive Technology
Chammas, H. (2013)
Description: Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology have a great potential for high frequency and high density applications. It also provides better signal performance, reduced parasitic and cross talk. This paper summarizes the selection of resistor embedded materials, evaluations of resistive material and duplication of a complex digital design.
A Case for Multiple Sheet Resistivities for Thin Film Embedded Resistor Packaging Applications
Hasegawa, C.; Hilburn, R. and Wang, J. (2008)
Description:
In this paper, the use of multiple sheet resistivities and their practical use is discussed. Low ohm/square material (i.e. 10 or 25 OPS) used in combination with the 1000 OPS is compared to a bill of materials with terminating and pull-up/down and the capture potential. The introduction of a 1000 ohm/square thin film embedded resistor material for this and other applications is also covered.
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit Manufacturing
Hilburn, R.; Parsons, D.; Wang, J.; and Zhang, S. (2007)
Description:
In this paper, the processing sequence and benefits of thin film embedded resistors in sequential build-up constructions are presented.
Non-Classical Conductor Losses Due to Copper Foil Roughness and Treatment
Brist, G.; Clouser, S.; Hall, S; and Liang, T. (2005)
Description:
This paper presents the results for a set of high-frequency loss characterizations across various copper foils and the impact of the copper roughness on the relationship between conductor loss and frequency. Also discussed in this paper are the implications in high-frequency modeling resulting from non-classical conductor losses and the requirements to ensure causality in simulation results.
Power Dissipation of Embedded Resistors
Clouser, S.; Davis, M.; Hilburn, R. and Wang, J. (2003)
Description:
In this paper, we present our experimental and finite element analysis (FEA) simulation results on the power dissipation ability of embedded resistors. These results can be used as design guidelines for embedded resistors.
Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance
Clouser, S.; Hilburn, R. and Wang, J. (2003)
Description:
Both the packaging and environmental stresses can change the value and tolerance of an embedded resistor. This work examines the effects of these process and environmental stresses on the ability of laser trimmed embedded thin film nickel-chromium alloy resistors to maintain value and tolerance.
Manufacturing Embedded Resistors
Clouser, S.; Greenlee, B.; Hilburn, R. and Wang, J. (2002)
Description:
This paper reviews data from Gould Electronics on the effects of specific processing factors on the overall tolerance of the resistor, and describes the board fabricator’s process development for reducing resistor variation and improving yields.
Thin Film Embedded Resistors
Clouser, S. and Wang, J. (2001)
Description:
This paper compares two nickel-chromium materials in their etching methodologies, uniformity, power handling, thermal performance, adhesion and etching resolution.