Ticer Technologies manufactures high-performance, thin-film embedded resistor copper foil for digital and RF printed circuit boards. Its next-generation technology for embedded resistors is uniquely suited to meet challenges posed by new designs, materials and increase performance requirements for current and future electronic packages. Enhanced by the capability and reliability of TCR, Ticer’s solutions utilize the latest in advanced laminate systems.

Founded in 1884 under the name Gould Electronic Materials, the company became the industry’s premier manufacturer of electrodeposited copper foil. In 1999, Gould developed TCR®, a revolutionary new thin-film foil product for embedding resistors in electronic packages. This next-generation material provided solutions for new, aggressive applications and the performance demands of advanced printed circuit boards.

When Gould’s parent company, Nippon Mining & Metals Co., discontinued its US operations in 2005, Ticer Technologies was formed by the core team at Gould that was vital to the development and commercialization of TCR. Through their efforts, Ticer continues to expand the acceptance of TCR across multiple electronic markets and applications.

Ticer’s unique partnership with the industry’s leading laminators ensures a flexible and robust distribution channel. All products are made to order, with the preferred laminate system and construction. Ticer proactively tests new laminate offerings to profile performance and acceptance for use with TCR.

The Ticer facility houses its own critical analytical tools and processing equipment. This technology investment allows Ticer to offer unparalleled customer support and implement continued improvement and new product development to meet the ever-changing requirements of digital and RF printed circuit boards.