TCR-HF is a low loss NiCr thin film embedded resistor copper foil designed for high frequency applications. The features of TCR-HF include: Smooth copper surface Rq roughness by Wyko: TCR-HF 0.48 µ vs. rolled foil 0.4 to 0.5 µ Minimal impact of resistor layer on insertion loss Peel strengths > 5 PLI on PTFE Available up to 51" width ½ oz foil – single side treatment The benefits of TCR-HF include: Great for high frequency applications Low insertion loss – comparable to rolled foil Resistance stable/reproducible after thermal excursion Utilizes existing PWB processes Use with PTFE resin systems Versatility TCR-HF is optimized to achieve maximum performance when used with PTFE resin systems. Greater Uniformity Thickness of the resistive layer is precisely controlled utilizing a proven vacuum metallization process. Precision vacuum metallization targets ensure uniform ratios of the elements in the deposited alloy, resulting in minimal resistance variation. The resistance is isotropic and is not dependent on the machine or grain direction of the copper foil or resistive layer. Product Performance and Predictability Ticer Technologies has gone to great lengths to profile the change in resistance of TCR-HF foil during lamination. The changes pertaining to specific laminate materials and lamination conditions are well understood. This predictability ensures the product provided to our customers is consistent lot-to-lot and sheet-to-sheet. Better Resistor Tolerances Final etch tolerances benefit from TCR-HF's thin and uniform resistive layer. TCR-HF can eliminate laser trim requirements in all but the most precisely toleranced resistors. Reduces Fabrication Steps TCR-HF with Nickel Chromium (NiCr) resistor alloy reduces fabrication steps by eliminating the need for a separate resistive layer etch. TCR-HF can be etched first in cupric chloride followed by ammoniacal etchant. An alternative etch for NiCr is acidic permanganate. Excellent Thermal Stability NiCr is well known for its excellent thermal stability under continuous load and thermal excursion. The material can be subjected to multiple thermal excursions, such as lead free reflow, with minimal resistance change and ensured long term reliability. The thermal stability of TCR-HF makes it the choice for designers and users with exacting thermal stability requirements. Technical data TCR-HF is available in a variety of foil widths using 0.5 oz Grade 3 copper foil. > Click here to download the product specifications. > Download the TCR-HF brochure by clicking here. > For a detailed data sheet and processing information click here. Zuken and Mentor Graphics design tools and software support the TCR material suite to create links.